Statistical analysis of the digital micromirror devices hinge sag phenomenon
| dc.creator | Rahman, Mohammed Mainur | |
| dc.date.accessioned | 2016-11-14T23:25:02Z | |
| dc.date.available | 2011-02-18T21:50:49Z | |
| dc.date.available | 2016-11-14T23:25:02Z | |
| dc.date.issued | 2002-05 | |
| dc.degree.department | Electrical and Computer Engineering | en_US |
| dc.description.abstract | The use of integrated circuit processing technology in order to manufacture Microelectromechanical systems is a relatively recent field of research. Texas Instruments, DLP™ has been the leader in optical MEMS devices, by inventing a commercially viable means of MEMS for projection displays. This thesis starts with a brief introduction to the DMD™ device, which is the heart of DLP™ technology. Then it gives a brief overview of hinge-related failures. The main objective of the thesis is to establish a relationship between hinge thickness, pre-bake temperature, and hinge sag in DMD™ devices. In order to achieve the goals of the thesis a Design of Experiments has been performed. The step-by-step approach of the experiment, the collection of data, and a detailed analysis of the results have been discussed in the thesis. | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/2346/17048 | en_US |
| dc.language.iso | eng | |
| dc.publisher | Texas Tech University | en_US |
| dc.rights.availability | Unrestricted. | |
| dc.subject | Hinges | en_US |
| dc.subject | Semiconductor switches | en_US |
| dc.title | Statistical analysis of the digital micromirror devices hinge sag phenomenon | |
| dc.type | Thesis |