Statistical analysis of the digital micromirror devices hinge sag phenomenon

Abstract

The use of integrated circuit processing technology in order to manufacture Microelectromechanical systems is a relatively recent field of research. Texas Instruments, DLP™ has been the leader in optical MEMS devices, by inventing a commercially viable means of MEMS for projection displays. This thesis starts with a brief introduction to the DMD™ device, which is the heart of DLP™ technology. Then it gives a brief overview of hinge-related failures. The main objective of the thesis is to establish a relationship between hinge thickness, pre-bake temperature, and hinge sag in DMD™ devices. In order to achieve the goals of the thesis a Design of Experiments has been performed. The step-by-step approach of the experiment, the collection of data, and a detailed analysis of the results have been discussed in the thesis.