Simulation and estimation of copper electroplating using level set methods and image processing techniques

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dc.creatorCarr, Nan Zhou
dc.date.accessioned2016-11-14T23:29:55Z
dc.date.available2011-02-18T22:13:37Z
dc.date.available2016-11-14T23:29:55Z
dc.date.issued2002-05
dc.degree.departmentMechanical Engineeringen_US
dc.description.abstractNot available.
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/2346/17801en_US
dc.language.isoeng
dc.publisherTexas Tech Universityen_US
dc.rights.availabilityUnrestricted.
dc.subjectLevel set methodsen_US
dc.subjectSemiconductor industry -- Quality controlen_US
dc.subjectSemiconductors -- Defectsen_US
dc.subjectCopper plating -- Simulationen_US
dc.subjectSemiconductors -- Design and constructionen_US
dc.subjectImage processingen_US
dc.subjectComputer visionen_US
dc.subjectElectroplatingen_US
dc.titleSimulation and estimation of copper electroplating using level set methods and image processing techniques
dc.typeDissertation

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