Statistical static timing analysis considering process variations and crosstalk

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dc.contributorWalker, Duncan M. (Hank)
dc.creatorVeluswami, Senthilkumar
dc.date.accessioned2005-11-01T15:45:23Z
dc.date.accessioned2017-04-07T19:50:25Z
dc.date.available2005-11-01T15:45:23Z
dc.date.available2017-04-07T19:50:25Z
dc.date.created2005-08
dc.date.issued2005-11-01
dc.description.abstractIncreasing relative semiconductor process variations are making the prediction of realistic worst-case integrated circuit delay or sign-off yield more difficult. As process geometries shrink, intra-die variations have become dominant and it is imperative to model them to obtain accurate timing analysis results. In addition, intra-die process variations are spatially correlated due to pattern dependencies in the manufacturing process. Any statistical static timing analysis (SSTA) tool is incomplete without a model for signal crosstalk, as critical path delays can increase or decrease depending on the switching of capacitively coupled nets. The coupled signal timing in turn depends on the process variations. This work describes an SSTA tool that models signal crosstalk and spatial correlation in intra-die process variations, along with gradients and inter-die variations.
dc.identifier.urihttp://hdl.handle.net/1969.1/2545
dc.language.isoen_US
dc.publisherTexas A&M University
dc.subjectTiming analysis
dc.subjectProcess variations
dc.subjectCrosstalk
dc.titleStatistical static timing analysis considering process variations and crosstalk
dc.typeBook
dc.typeThesis

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