Parameter extraction and characterization of transmission line interconnects based on high frequency measurement
| dc.contributor.advisor | Neikirk, Dean P. | en |
| dc.creator | Kim, Jooyong | en |
| dc.date.accessioned | 2008-08-28T23:15:36Z | en |
| dc.date.available | 2008-08-28T23:15:36Z | en |
| dc.date.issued | 2006 | en |
| dc.description | text | en |
| dc.description.abstract | New materials have been, and continue to be, introduced in an effort to reduce the impact of interconnect delay on performance. The accurate experimental characterization of on-wafer transmission lines, particularly lines using copper and low-k materials, is critically important to on-going high-speed digital integrated circuit designers. This dissertation aimed to examine the accurate electrical parameter extraction and characterization of on-wafer embedded microstrip transmission line test structures using high frequency measurements up to 40GHz in determining on-going high-speed digital integrated system performance. In particular we aimed to determine the dielectric constant and loss of low-k dielectric materials, as well as the accurate de-embedding network model of pads on interconnect parameter extraction, the impact of finite measurement precision and error propagation in on-wafer microwave measurement, and the impact of probe placement on high frequency on-wafer measurement. | |
| dc.description.department | Electrical and Computer Engineering | en |
| dc.format.medium | electronic | en |
| dc.identifier | b68635746 | en |
| dc.identifier.oclc | 166236379 | en |
| dc.identifier.uri | http://hdl.handle.net/2152/2909 | en |
| dc.language.iso | eng | en |
| dc.rights | Copyright is held by the author. Presentation of this material on the Libraries' web site by University Libraries, The University of Texas at Austin was made possible under a limited license grant from the author who has retained all copyrights in the works. | en |
| dc.subject.lcsh | Strip transmission lines--Testing | en |
| dc.subject.lcsh | Strip transmission lines--Measurement | en |
| dc.subject.lcsh | Interconnects (Integrated circuit technology)--Measurement | en |
| dc.subject.lcsh | Dielectric measurements | en |
| dc.title | Parameter extraction and characterization of transmission line interconnects based on high frequency measurement | en |
| dc.type.genre | Thesis | en |