An experimental study of endwall heat transfer enhancement for flow past staggered non-conducting pin fin arrays

Simple item page
dc.contributorLau, Sai C.
dc.creatorAchanta, Vamsee Satish
dc.date.accessioned2004-09-30T01:43:31Z
dc.date.accessioned2017-04-07T19:48:05Z
dc.date.available2004-09-30T01:43:31Z
dc.date.available2017-04-07T19:48:05Z
dc.date.created2003-05
dc.date.issued2004-09-30
dc.description.abstractIn this work, we study the enhanced endwall heat transfer for flow past non conducting pin fin arrays. The aim is to resolve the controversy over the heat transfer that is taking place from the endwall and the pin surface.Various parameters were studied and results were obtained. Our results are found to be consistent with some of the results that have been previously published. The results were surprisingly found to be dependent on the height of the pin fin.
dc.identifier.urihttp://hdl.handle.net/1969.1/140
dc.language.isoen_US
dc.publisherTexas A&M University
dc.subjectEndwall Heat Transfer for Pin Fin Arrays
dc.titleAn experimental study of endwall heat transfer enhancement for flow past staggered non-conducting pin fin arrays
dc.typeBook
dc.typeThesis

Files

Collections

Texas A&M University at College Station