Formation of ultra-thin Ta-based Cu diffusion barrier with atomic layer deposition

Ho, P. S.847361302008-08-282017-05-112008-08-282017-05-112006http://hdl.handle.net/2152/2573textelectronicengCopyright is held by the author. Presentation of this material on the Libraries' web site by University Libraries, The University of Texas at Austin was made possible under a limited license grant from the author who has retained all copyrights in the works.Dielectrics--SurfacesFormation of ultra-thin Ta-based Cu diffusion barrier with atomic layer depositionThesis