Unrestricted.2016-11-142011-02-192016-11-142002-12http://hdl.handle.net/2346/22426Device scaling beyond O.IO um technologies is severely restricted by the lack of any "manufacturable" solutions to activate the implanted species in Ultra Shallow junctions (USJ). The hardware and process modifications were directed to improve the spike sharpness. Different designs for the edge ring and the pyrometers have been tried and successfully implemented. This dilemma is resolved with the design of a spectral coating that maximizes reflectivity in the pyrometer band pass and maximizes absorptivity in the longer wavelengths.application/pdfengRapid thermal processingSemiconductor wafers -- Thermal propertiesThesis