Simulation and estimation of copper electroplating using level set methods and image processing techniques

Date

2002-05

Authors

Journal Title

Journal ISSN

Volume Title

Publisher

Texas Tech University

Abstract

Not available.

Description

Keywords

Level set methods, Semiconductor industry -- Quality control, Semiconductors -- Defects, Copper plating -- Simulation, Semiconductors -- Design and construction, Image processing, Computer vision, Electroplating

Citation

URI

http://hdl.handle.net/2346/17801

Collections

Texas Tech University