An experimental study of endwall heat transfer enhancement for flow past staggered non-conducting pin fin arrays
Date
2004-09-30
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Publisher
Texas A&M University
Abstract
In this work, we study the enhanced endwall heat transfer for flow past non conducting pin fin arrays. The aim is to resolve the controversy over the heat transfer that is taking place from the endwall and the pin surface.Various parameters were studied and results were obtained. Our results are found to be consistent with some of the results that have been previously published. The results were surprisingly found to be dependent on the height of the pin fin.