Study of PECVD Films Containing Flourine and Carbon and Diamond Like Carbon Films for Ultra Low Dielectric Constant Interlayer Dielectric Applications

Date

2016-12

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Description

Keywords

PECVD, Plasma-enhanced chemical vapor deposition, ULK, Dielectric films, Integrated circuits, Amorphous substances, Fluorocarbons

Citation

URI

http://hdl.handle.net/10735.1/5198

Collections

University of Texas at Dallas